Cross-Sectional Analysis — Elmet
Applying microscopic analytic techniques for failure analysis in electronic assemblies | Applied Microscopy | Full Text
The HDG Coating | American Galvanizers Association
Hurtony Tamás
Mounted Part Defects/Reliability Tests of Solder - JFE Techno-Research Corporation
Gold–aluminium intermetallic - Wikipedia
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？ | I am a Manufacturing Process Engineer (MPE)
Cross-Sectional Analysis — Elmet
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad - ScienceDirect
Cross-Sectional Analysis — Elmet
Effect of shape-memory alloy NiTi fiber on microstructure and mechanical properties of continuous ceramic Al2O3 fiber-reinforced Ti/Al3Ti metal– intermetallic laminated composite - Yuqiang Han, Junyi Zhu, Haoran Yan, Chunfa Lin, Zhilei Zhao, Xuecong
Microsection / Cross-Section Analysis
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces | Emerald Insight
The Role of Aluminium in Continuous Galvanizing - Ark Novin
Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene | ACS Applied Materials & Interfaces
Cross section morphology of Cu 6 Sn 5 IMC grown at the interface of... | Download Scientific Diagram
Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders
What are Intermetallics and How Can We Overcome the Failures Associated with Them?
Why perform cross-sectional evaluation of circuit boards (PCB)? | Element
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections | SpringerLink
Cross-section BSE images of the substrate-side IMC layers after thermal... | Download Scientific Diagram
Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate
The cross sections of the as-diffusion alloyed intermetallic layer... | Download Scientific Diagram
Microsection | BGA Cross Section Analysis
Figure 10 from Investigating the mechanical strength of Vapor Phase soldered chip components joints | Semantic Scholar
